AXT Completes the Ramp of OSRAM Shipments from New, Dingxing Manufacturing Facility
“We are very pleased to be able to fully support OSRAM’s requirements from our new, world-class manufacturing facility in Dingxing,” said
Dingxing is approximately 75 miles from Beijing. AXT began offering wafers from its new facility for customer qualification in 2019, and began customer site qualifications later that year. The relocation process was prompted by the Beijing city government’s selection of Tongzhou for its new municipal headquarters. Along with many other businesses asked to relocate their manufacturing lines in order to create room and upgrade the district, AXT was instructed to relocate its gallium arsenide manufacturing line.
AXT is a material science company that develops and manufactures high-performance compound and single element semiconductor substrate wafers comprising indium phosphide (InP), gallium arsenide (GaAs) and germanium (Ge). The company’s substrate wafers are used when a typical silicon substrate wafer cannot meet the performance requirements of a semiconductor or optoelectronic device. End markets include 5G infrastructure, data center connectivity (silicon photonics), passive optical networks, LED lighting, lasers, sensors, power amplifiers for wireless devices and satellite solar cells. AXT’s worldwide headquarters are in
The foregoing paragraphs contain forward-looking statements within the meaning of the Federal securities laws, including, for example, statements regarding the market demand for our products, our growth prospects and opportunities for continued business expansion, our market opportunity, our relocation and our expectations with respect to our business prospects and financial results. These forward-looking statements are based upon assumptions that are subject to uncertainties and factors relating to the company’s operations and business environment, which could cause actual results to differ materially from those expressed or implied in the forward-looking statements contained in the foregoing discussion. These uncertainties and factors include but are not limited to: the timing and receipt of significant orders; the cancellation of orders and return of product; emerging applications using chips or devices fabricated on our substrates; end-user acceptance of products containing chips or devices fabricated on our substrates; our ability to bring new products to market; product announcements by our competitors; the ability to control costs and improve efficiency; the ability to utilize our manufacturing capacity; product yields and their impact on gross margins; the relocation of manufacturing lines and ramping of production; possible factory shutdowns as a result of air pollution in
Chief Financial Officer
Source: AXT, Inc.